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128Mb: x16 Mobile SDRAM
Package Dimensions
Package Dimensions
Figure 49:
54-Ball VFBGA (8mm x 8mm)
0.65 ±0.05
SEATING PLANE
0.10 C
54X ?0.45 ±0.05
C
SOLDER BALL MATERIAL:
96.5% Sn, 3% Ag, 0.5% Cu (Lead-Free – B4)
SOLDER MASK DEFINED BALL PADS: ?0.40
SOLDER BALL
DIAMETER REFERS
TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER
6.40
0.80
TYP
BALL A1 ID
SUBSTRATE MATERIAL: PLASTIC LAMINATE
MOLD COMPOUND: EPOXY NOVOLAC
BALL A1 ID
IS 0.42.
BALL A9
6.40
3.20 ±0.05
3.20 ±0.05
C L
4.00 ±0.05
BALL A1
4.00 ±0.05
C L
8.00 ±0.10
0.80 TYP
8.00 ±0.10
1.00 MAX
Notes:
1. All dimensions are in millimeters.
?
8000 S. Federal Way, P.O. Box 6, Boise, ID 83707-0006, Tel: 208-368-3900
prodmktg@micron.com www.micron.com Customer Comment Line: 800-932-4992
Micron, the M logo, and the Micron logo are trademarks of Micron Technology, Inc. All other trademarks are the property of
their respective owners.
This data sheet contains minimum and maximum limits specified over the complete power supply and temperature range
for production devices. Although considered final, these specifications are subject to change, as further product
development and data characterization sometimes occur.
PDF: 09005aef8237e877/Source: 09005aef8237e8d8
128Mb_x16 Mobile SDRAM_Y25M_2.fm - Rev. C 2/07 EN
63
Micron Technology, Inc., reserves the right to change products or specifications without notice.
?2006 Micron Technology, Inc. All rights reserved.
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